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Electrical Moldings

Since 1963, our thermo-plastic molding operations have been dedicated to meeting client requirements for very challenging geometries and sub-micron tolerances. Precision Engineered Products can provide prototypes in as few as 3 days. Applications include overmolding of sensitive electrical components to eliminate high cost potting operations, connectors, pin grid arrays and other electrical components.

Our engineers will work with you in the development of automated systems using robotics, video inspection and testing features to insure conformance to your specifications. Design tools such as Moldflow® analysis software, finite element analysis (FEA) and fused deposition modeling are used to validate design concepts before tooling is constructed.

Precision Engineered Products is a full-service, one-stop supplier of highly engineered plastic and metal/plastic components for use in critical electrical and electronic components. Our expertise is delivering quality production on highly technical, complex molding programs across a multitude of markets.

Electronics Molding

electronics molding

Hole diameters as small as 70µm in thin walls, with concentricity of coaxial features within 10µm. Precision pin grid and ball grid arrays. Opto-electronic prisms, lens arrays and other opto components.

PEP is one of the few manufacturers who can mold integrated circuit connector insulators with hundreds of contact holes in eight or more rows, holding tolerance of +/- 13µm on contact hole diameters and +/- 50µm on centerline distances. Our capabilities in precision injection molding have enabled us to assist customers in the development of encapsulation molding to eliminate costly potting operations. This allows the user to avoid problematic environmental issues associated with disposing of these potting materials and is particularly effective in encapsulation discrete components and Hall effect sensors. The Precision Engineered Products cross-functional teams provide advance product quality planning that results in solutions to the most demanding molding problems.

Communications Packages

communications packages

Liquid crystal polymer (LCP) resins used in near-hermetic microelectronics packaging molding. Flip chip and multi-pin interconnect devices and direct chip encapsulation.

Liquid crystal polymers have emerged as a preferred resin for electronic and opto-electronic communications packaging both for its superior moisture barrier properties and its ability to fill extremely thin walls and features on ever-decreasing package sizes. Precion Engineered Products has kept pace with advances in these resin technologies and we have expanded our capabilities into producing sophisticated multi-lens arrays, prisms and light pipe components for various photonic communications applications. LCPs also offer the ability to develop near-hermetic sealing solutions to eliminate more expensive ceramic and Kovar packages.

Using diamond turning and proprietary mold making processes, we routinely produce parts with lens surface finishes to within ¼ to ½ wavelength, hole diameters as small as 70µm, part weights as small as 0.10 grams and flatness of mirror surfaces within 10µm.

Insert and Overmolding

insert and overmolding

High volume, totally automated cells, with plastic-over-metal, plastic-over-plastic and plastic-over-glass capabilities. These cells integrate programmable process control sensors to insure maximum uptime.

We have served many world class companies to deliver a variety of products for electrical and electronic applications. Although we mold and insert mold products from nylons, polycarbonates, acetals, thermoplastic polyesters and ABS resins, both filled and unfilled, we specialize in molding plastic and plastic-over-metal parts from high temperature-resistant resins, both filled and unfilled. These resins include LCP (carbon and fiberglass reinforced), PEEK, Teflon® PFA, PEEK, PES, PPS and other resins, both unfilled and reinforced. Applications include connectors and interconnects, ball grid arrays, load side electrical contact assemblies for metering, stators, impellers and other demanding uses.

Our process capabilities are backed up by state-of-the-art metrology: 3-D modeling that enables critical design adjustments before expensive tooling investment, digital interferometry to meet the toughest TQM specifications, and FTIR spectophotometry for precise materials testing.

  • Micron tolerance moldings
  • Features as low as 2 microns
  • Part weights as low as 0.0001 gram
  • Single-point diamond turning (thermoplastics and non-ferrous metals)
  • Materials – PEEK, LCP, TPE, PC, Ultem®, Pebax®, olefins and more
  • Fused deposition modeling, Moldflow® and other software

Molding and Robotics

Molding & Robotics

Our molding operations are set up with robotic equipment capable of loading inserts, sprue removal, part separation, ultrasonic welding and device assembly, all to provide you with superior value.

The flexibility inherent in robotic equipment is augmented by high volume, automated cells. These production capabilities give you options to develop the optimum in production cost-effectiveness — the adaptability of robotic production across multiple part platforms and assembly requirements versus the high assembly speeds, process capabilities and product repeatability coming from fully automated molding operations. With our expertise in process and mold design, high volume molding and assembly requirements are easily supported regardless of which technology platform you choose.

Our engineering services have the resources to help support and develop your most difficult design programs to full manufacturing capability.